Title :
Influence of segregation and diffusion behavior on electrical properties of embedded Ni- Cr thin film resistor
Author :
Lifei Lai ; Rong Sun ; Xianzhu Fu ; Ruxu Du
Author_Institution :
Shenzhen Inst. of Adv. Technol., Shenzhen, China
Abstract :
The segregation and diffusion of Ni-Cr embedded thin film resistor (ETFR) materials under different annealing conditions were investigated. Strong segregation and diffusion were caused by annealing at high temperature. The electrical properties of Ni- Cr ETFR were affected by segregation and diffusion of metal, which led unstable TCR and large resistivity.
Keywords :
annealing; chromium; nickel; thin film resistors; ETFR materials; Ni-Cr; annealing condition; diffusion behavior; electrical properties; embedded nickel-chromium thin film resistor; metal diffusion; metal segragation; segregation behavior; Annealing; Copper; Films; Nickel; Resistors;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474622
