• DocumentCode
    3502431
  • Title

    Minimizing ohmic loss in future processor IR events

  • Author

    Budnik, Mark M. ; Roy, Kaushik

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
  • fYear
    2006
  • fDate
    27-29 March 2006
  • Lastpage
    658
  • Abstract
    IR events are periods in time when processors draw a high level of steady state operating current. During IR events, ohmic losses occur in the power delivery path. To minimize these ohmic losses, conventional systems use parallelism to reduce the resistance of the power delivery path. As operating currents continue to increase, however, additional remedies may be required to maintain acceptable ohmic losses. We show how a processor with integrated step down converters can be used to reduce the ohmic loss in its power delivery path. In a 130nm technology node, our integrated solution can reduce the delivery path ohmic loss by 32.8%
  • Keywords
    integrated circuit design; logic design; microprocessor chips; 130 nm; integrated step down converters; ohmic losses; power delivery path; processor IR events; steady state operating current; Electric resistance; Microprocessors; Optical computing; Parallel processing; Power dissipation; Power engineering and energy; Power engineering computing; Regulators; Steady-state; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2006. ISQED '06. 7th International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7695-2523-7
  • Type

    conf

  • DOI
    10.1109/ISQED.2006.88
  • Filename
    1613211