Title :
Study on the electrodeposition of Fe-Ni UBM films in modified watts bath
Author :
Hao Zhang ; Li Zhang ; Zhenzhen Duan ; Chi-Ming Lai ; Zhi-Quan Liu
Author_Institution :
Shenyang Nat. Lab. for Mater. Sci., Inst. of Metal Res., Shenyang, China
Abstract :
The electroplating process of Fe-Ni UBM thin film has been developed using modified Watts bath and customized wafer electroplating system. The main factors which can affect the Fe content in the UBM film have been thoroughly investigated. Two kinds of chemical analysis methods, titration and spectrophotography, were used to monitor the variation of bath component content under working condition. The deposition speed under different plating conditions had been investigated by measuring the thickness of Fe-Ni deposited layer.
Keywords :
chemical analysis; electronics packaging; electroplating; iron alloys; nickel alloys; thin films; Fe-Ni; UBM thin film; chemical analysis methods; customized wafer electroplating system; deposited layer; electrodeposition; electroplating process; modified Watts bath; spectrophotography; titration; Current density; Films; Iron; Nickel; Temperature measurement;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474636
