DocumentCode
3502748
Title
Spontaneous tin whisker growth from rare-earth tin alloys
Author
Zhi-Quan Liu ; Cai-Fu Li
Author_Institution
Shenyang Nat. Lab. for Mater. Sci., Inst. of Metal Res., Shenyang, China
fYear
2012
fDate
13-16 Aug. 2012
Firstpage
373
Lastpage
375
Abstract
Tin whisker growth phenomena from rare-earth tin alloys were investigated with both scanning electron microscopy and transmission electron microscopy. Large quantities of tin whiskers with diameters from 20 nm to 10 μm and length from 50 nm to 500 μm were formed on the surface of the alloys at a growth rate of 0.1~1.8 nm·s-1. The growth directions of tin whiskers were studied among more than 200 whiskers. It was found that this kind of tin whisker is single crystal β-Sn even it has striations, steps, and kinks, but no dislocation and twin or grain boundary was observed within the whisker body. RESn3 compounds in the alloys endure selective oxidation during whisker growth, which provides continuous tin atoms for tin whisker growth and compressive stress as driving force. The growth models of tin whisker and hillock on rare-earth tin alloys were discussed upon the observations.
Keywords
compressive strength; rare earth alloys; scanning electron microscopy; tin alloys; transmission electron microscopy; RESn3 compounds; compressive stress; rare-earth tin alloys; scanning electron microscopy; size 20 nm to 10 mum; size 50 nm to 500 mum; tin whisker growth; transmission electron microscopy; Oxidation; Scanning electron microscopy; Surface morphology; Tin; Transmission electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4673-1682-8
Electronic_ISBN
978-1-4673-1680-4
Type
conf
DOI
10.1109/ICEPT-HDP.2012.6474637
Filename
6474637
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