DocumentCode :
3502831
Title :
Question: DRC or DfM? Answer: FMEA and ROI
Author :
Balasinski, Artur
Author_Institution :
Cypress Semicond., San Jose, CA
fYear :
2006
fDate :
27-29 March 2006
Lastpage :
794
Abstract :
Design for manufacturability (DfM) is a design verification methodology linked to a set of requirements that can be perceived as gray area within the design rule check (DRC) approach based on rigid pass/fail criteria. This is because the DfM rules, unlike DRC, are not directly responsible for the functionality of individual devices, but are broadly scoped to address the die yield over the process corners. At the same time, all design rules are to ensure high performance and profit margins. Therefore, the distinction between DfM and DRC rules is often artificial and confusing. In this paper, we propose how to combine all design rules into one enforceable deck, regardless of their origin, and introduce an implementation cutoff lines decided by technology and business factors. This new methodology is based on the failure mode and effect analysis (FMEA) and return on investment (RoI). FMEA, involving the criticality, occurrence, and detectability of failure modes, is demonstrated for DfM rules focused on system on chip (SoC). The results are then correlated to those of the RoI approach for the same set of rules
Keywords :
design for manufacture; design for testability; failure analysis; system-on-chip; DRC; DfM; FMEA; ROI; design for manufacturability; design rule check; design verification; enforceable deck; failure mode and effect analysis; return on investment; rigid pass/fail criteria; Degradation; Design engineering; Design for manufacture; Design methodology; Failure analysis; Integrated circuit yield; Investments; Manufacturing; Semiconductor device manufacture; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design, 2006. ISQED '06. 7th International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
0-7695-2523-7
Type :
conf
DOI :
10.1109/ISQED.2006.110
Filename :
1613232
Link To Document :
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