DocumentCode
3502973
Title
Silver-based thermal interface materials with low thermal resistance
Author
Hui Yu ; Rui Zhang ; Liangliang Li ; Xiaofei Mao ; Hongda Du
Author_Institution
Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
fYear
2012
fDate
13-16 Aug. 2012
Firstpage
410
Lastpage
413
Abstract
We investigated the thermal conduction performance of thermal interface materials (TIM) using silver paste (SP) and silver nanoparticles (AgNPs) before and after thermal cycling. We also studied the cause that could affect the thermal resistance of SP and AgNPs after thermal cycling. The experimental data show that SP and AgNPs are good candidates for the TIM with low thermal resistance used for power electronics applications.
Keywords
nanoparticles; power electronics; thermal resistance; AgNP; SP; TIM; low thermal resistance; power electronics applications; silver nanoparticles; silver paste; silver-based thermal interface materials; thermal cycling; Electronic packaging thermal management; Materials; Nanoparticles; Silver; Thermal conductivity; Thermal resistance; silver nanoparticle; silver paste; thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4673-1682-8
Electronic_ISBN
978-1-4673-1680-4
Type
conf
DOI
10.1109/ICEPT-HDP.2012.6474646
Filename
6474646
Link To Document