DocumentCode :
3503177
Title :
CMOS front-end architecture for In-Vivo biomedical implantable devices
Author :
Colomer-Farrarons, J. ; Miribel-Catalá, P. ; Rodrìguez, I. ; Samitier, J.
Author_Institution :
Electron. Dept., Univ. de Barcelona, Barcelona, Spain
fYear :
2009
fDate :
3-5 Nov. 2009
Firstpage :
4401
Lastpage :
4408
Abstract :
An integrated front-end architecture for in-vivo detection is presented. The system is conceived to be implanted under the human skin. The powering and communication between this device and an external primary transmitter are based on an inductive link. The presented architecture is oriented to two different approaches, defining a true/false alarm system, based on amperometric or impedance biosensors. The particular case of the amperometric sensor is used to validate the architecture in terms of different integrated modules fabricated in a 0.13 ¿m technology. A potentiostat amplifier has been integrated to control an amperometric biosensor as well as a current sensing method based on a transimpedance amplifier is used to measure the current. It is also introduced the electronics designed for the bio-impedance case.
Keywords :
CMOS integrated circuits; amperometric sensors; biomedical electronics; biomedical measurement; electric impedance measurement; operational amplifiers; telemedicine; CMOS front-end architecture; amperometric biosensor; bio-impedance case; device communication; device powering; external primary transmitter; human skin; impedance biosensor; in-vivo biomedical implantable devices; inductive link; integrated modules; potentiostat amplifier; size 0.13 mum; transimpedance amplifier; true/false alarm system; Biomedical measurements; Biosensors; Current measurement; Humans; Impedance measurement; Instruments; Monitoring; Sensor arrays; Skin; Sugar;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics, 2009. IECON '09. 35th Annual Conference of IEEE
Conference_Location :
Porto
ISSN :
1553-572X
Print_ISBN :
978-1-4244-4648-3
Electronic_ISBN :
1553-572X
Type :
conf
DOI :
10.1109/IECON.2009.5414902
Filename :
5414902
Link To Document :
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