Title :
Electrothermal simulation methodology for power devices and integrated circuits
Author :
Vales, Patrick ; Dorkel, Jean-Marie
Author_Institution :
Lab. d´´Anal. et d´´Archit. des Syst., CNRS, Toulouse, France
fDate :
29 Sep-1 Oct 1996
Abstract :
The paper first discusses the limitations of implicit electrothermal modeling of switching power circuits. Then it introduces an original methodology for electrothermal simulation of switching power electronics circuits in hybrid or integrated assemblies. Feasibility is demonstrated through the example of a simple chopper circuit operating at constant duty cycle and an illustration is made using a smartpower circuit
Keywords :
choppers (circuits); circuit analysis computing; digital simulation; integrated circuit modelling; power integrated circuits; power semiconductor devices; semiconductor device models; switching circuits; thermal analysis; chopper circuit; constant duty cycle; electrothermal modeling; electrothermal simulation methodology; hybrid assemblies; integrated assemblies; power IC; power devices; power electronics circuits; smartpower circuit; switching power circuits; Choppers; Circuit simulation; Computational modeling; Coupling circuits; Electrothermal effects; Integrated circuit modeling; Power electronics; Switching circuits; Temperature dependence; Temperature sensors;
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 1996., Proceedings of the 1996
Conference_Location :
Minneapolis, MN
Print_ISBN :
0-7803-3516-3
DOI :
10.1109/BIPOL.1996.554621
