Electrothermal simulation methodology for power devices and integrated circuits

Author

Vales, Patrick ; Dorkel, Jean-Marie

Author_Institution

Lab. d´´Anal. et d´´Archit. des Syst., CNRS, Toulouse, France

fYear

1996

fDate

29 Sep-1 Oct 1996

Firstpage

118

Lastpage

121

Abstract

The paper first discusses the limitations of implicit electrothermal modeling of switching power circuits. Then it introduces an original methodology for electrothermal simulation of switching power electronics circuits in hybrid or integrated assemblies. Feasibility is demonstrated through the example of a simple chopper circuit operating at constant duty cycle and an illustration is made using a smartpower circuit

Keywords

choppers (circuits); circuit analysis computing; digital simulation; integrated circuit modelling; power integrated circuits; power semiconductor devices; semiconductor device models; switching circuits; thermal analysis; chopper circuit; constant duty cycle; electrothermal modeling; electrothermal simulation methodology; hybrid assemblies; integrated assemblies; power IC; power devices; power electronics circuits; smartpower circuit; switching power circuits; Choppers; Circuit simulation; Computational modeling; Coupling circuits; Electrothermal effects; Integrated circuit modeling; Power electronics; Switching circuits; Temperature dependence; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Bipolar/BiCMOS Circuits and Technology Meeting, 1996., Proceedings of the 1996

Conference_Location

Minneapolis, MN

ISSN

1088-9299

Print_ISBN

0-7803-3516-3

Type

conf

DOI

10.1109/BIPOL.1996.554621

Filename

554621