Title :
Analysis of new lead-free solder alloy microstructure
Author :
Zhiting Geng ; He Qing ; Guohai Cheng ; Jusheng Ma
Author_Institution :
Sch. of Energy & Power Eng., North China Electr. Power Univ., Beijing, China
Abstract :
Combining with the analysis of solder melting point, spreading rate and tensile strength, a new Sn-Zn lead-free solder system has been developed. The solder melting point is 183 °, it is very close to Pb-Sn eutectic solder melting temperature, the corresponding melting range of this solder is smaller, and it has higher bonding force and other advantages, completely meeting the requirements of the electronic industry. Because the material performances are Influenced by the microstructure, so the alloy microstructure was investigated, and the influencing factors of the alloy microstructure on properties have been found.
Keywords :
eutectic alloys; lead alloys; melting point; solders; tensile strength; tin alloys; zinc alloys; Pb-Sn; Sn-Zn; alloy microstructure; bonding force; electronic industry; eutectic solder melting temperature; lead-free solder alloy microstructure; lead-free solder system; solder melting point analysis; tensile strength; Fatigue; Lead; Liquids; Strips; Tin; Zinc;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474661
