Analysis of new lead-free solder alloy microstructure

Author

Zhiting Geng ; He Qing ; Guohai Cheng ; Jusheng Ma

Author_Institution

Sch. of Energy & Power Eng., North China Electr. Power Univ., Beijing, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

469

Lastpage

471

Abstract

Combining with the analysis of solder melting point, spreading rate and tensile strength, a new Sn-Zn lead-free solder system has been developed. The solder melting point is 183 °, it is very close to Pb-Sn eutectic solder melting temperature, the corresponding melting range of this solder is smaller, and it has higher bonding force and other advantages, completely meeting the requirements of the electronic industry. Because the material performances are Influenced by the microstructure, so the alloy microstructure was investigated, and the influencing factors of the alloy microstructure on properties have been found.

Keywords

eutectic alloys; lead alloys; melting point; solders; tensile strength; tin alloys; zinc alloys; Pb-Sn; Sn-Zn; alloy microstructure; bonding force; electronic industry; eutectic solder melting temperature; lead-free solder alloy microstructure; lead-free solder system; solder melting point analysis; tensile strength; Fatigue; Lead; Liquids; Strips; Tin; Zinc;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474661

Filename

6474661