A quick turn packaging solution and its application

With the rapid development of semiconductor industry, reducing time-to-market and cost become very important for manufacturing companies during product development. Generally, customized substrate is required for each chip design in IC packaging. However, design and manufacture of customized substrate usually take several weeks, which significantly impact cycle time of product development. To solve the problem, some companies offer Ceramic Open Tooled Package (COTP), which is very expensive and challenging for assembly. In this paper, organic-based Multi-Program Package (MPP) is proposed and analyzed as an efficient and low cost solution to accelerate packaging development, especially for pilot run of packaging. Universality is a typical feature of MPP. MPP provides a quick turn solution for chips with different designs, such as different functions, die sizes, numbers of 110, distributions of die pads, through a series of specially designed substrates. The MPP substrates can be designed and manufactured in advance. Then customers choose suitable MPP solution according to their chip design and package requirements. By proper modification of bonding diagram, the product will be packaged through standard assembly process. In this way, customers like IC design houses may have a flexible choice to realize their pilot run. In this paper, an example of real MPP application, MPP121, is introduced. MPP121 adopted Plastic Ball Grid Array (PBGA) package structure. The substrate design is applied for nine packages with different die size and 110 number. Electrical and reliability test results showed an excellent chip performance after package.