DocumentCode :
3503615
Title :
Numerical simulation of reheating system heat transfer coefficient with H63 brass alloy
Author :
Kaikun Wang ; Qingluan He ; Xianhui Li
Author_Institution :
Sch. of Mater. Sci. & Eng., Univ. of Sci. & Technol., Beijing, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
525
Lastpage :
528
Abstract :
Based on the platform of DEFORM software, the H63 brass alloy material model was developed, and then use the thermocouple temperature measurement method, measure the heating curves of the H63 brass alloy of different specific points during the secondary heating process, import this curve into the Inverse Heat module, in this case the inverse calculation of the heat transfer coefficient (HTC) of reheating system was proceed and a good HTC curve was obtained. Numerical simulation results showed that HTC became larger when the temperature difference between the specific point and the reheating environment increased, this trend consistent with the theory. This study provides important theoretical basis for semi-solid secondary heating process parameter optimizations and the follow-up thixoforming.
Keywords :
alloys; heat transfer; numerical analysis; optimisation; thermocouples; thixoforming; DEFORM software; H63 brass alloy; HTC; heat transfer coefficient; inverse heat module; numerical simulation; parameter optimizations; reheating system; thermocouple temperature measurement; thixoforming; Abstracts; Heating; Iron; Lead; Nickel; Temperature measurement; Zinc; heat transfer coefficient; numerical simulation; reheating; thermocouple temperature measurement method;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474673
Filename :
6474673
Link To Document :
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