Title :
Parameterized modeling and thermal analysis of high-power LED package with GMSH and GetDP
Author :
Dai Weifeng ; Li Yuesheng ; Rumao, R. ; Zhou Yinyuan ; Li Shuzhi ; Ma Kejun
Author_Institution :
Dept. of Mater. Sci., Fudan Univ., Shanghai, China
Abstract :
We develop a method of parameterized modeling and FEM (Finite Element Method) analysis for high-power LED package with GetDP and GMSH. GMSH is applied on preprocessing and post-processing and GetDP works as a FEM solver. In our paper we show the Bottom-Up parameterized modeling method that is very useful for studying high-power LED package processes. A real high-power LED package is analyzed here and we can calculate the influence of geometrical factors on the processes interfaces.
Keywords :
finite element analysis; light emitting diodes; thermal analysis; thermal management (packaging); FEM solver; GMSH; GetDP; bottom-up parameterized modeling method; finite element method; geometrical factor; high-power LED package; thermal analysis; Abstracts; Analytical models; Equations; Heating; Mathematical model; Reliability theory; FEM; GMSH; GetDP; High-Power LED; Package Process; Thermal Analysis;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474676
