DocumentCode
3503723
Title
Highly uniform and stable electron field emission from B-doped Si-tip arrays for applications in integrated vacuum microelectronic devices
Author
Schreiner, R. ; Prommesberger, C. ; Langer, C. ; Dams, F. ; Serbun, P. ; Bornmann, B. ; Navitski, A. ; Müller, G.
Author_Institution
Fac. of Microsyst. Technol., Regensburg Univ. of Appl. Sci., Regensburg, Germany
fYear
2012
fDate
9-13 July 2012
Firstpage
1
Lastpage
2
Abstract
In order to improve the uniformity and field emission stability of p-type silicon tip arrays for pulsed sensor applications, we have systematically studied the influence of the fabrication parameters on the tip shape and the specific operating conditions. Based on detailed design calculations of the field enhancement, we have fabricated a series of hexagonal arrays of B-doped Si-tips in a triangular arrangement, each containing a different number of tips (91, 575 and 1300) of 1 μm height, 20 nm apex radius, and 20 μm pitch. The field emission properties of both individual tips and complete arrays were investigated with by field emission scanning microscopy. The current plateaus of these tips typically occur at about 10 nA and 60 V/μm field level. In this carrier depletion range, single tips provide the highest current stability (<; 4%) and optical current switching ratios of ~2.5. Rather homogeneous emission of the tip arrays leads to an almost linear scaling of the saturation current (2 nA/tip) and to a much improved current stability (<; 1%) measured over 1 hour.
Keywords
boron; circuit stability; elemental semiconductors; field emission ion microscopy; field emitter arrays; integrated optoelectronics; microfabrication; microsensors; optical switches; silicon; Si:B; carrier depletion range; current plateaus; current stability; electron field emission stability; field emission scanning microscopy; hexagonal array series fabrication; integrated vacuum microelectronic device; optical current switching ratio; pulsed sensor application; size 1 mum; size 20 mum; size 20 nm; tip array emission; tip shape parameter fabrication; triangular arrangement; Cathodes; Circuit stability; Current measurement; Fabrication; Iron; Silicon; Voltage measurement; field emitter arrays; silicon tips;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Nanoelectronics Conference (IVNC), 2012 25th International
Conference_Location
Jeju
ISSN
pending
Print_ISBN
978-1-4673-1983-6
Electronic_ISBN
pending
Type
conf
DOI
10.1109/IVNC.2012.6316857
Filename
6316857
Link To Document