DocumentCode :
3503781
Title :
Characterization of metal contact layer prepared by arc spray method and their effects in metallized film capacitor
Author :
Park, Sang Shik ; Park, Du Hwan ; Choi, Jung Heon ; Kim, Byeong Wook ; Kim, Sung Ho
Author_Institution :
R&D Labs., Samwha Electr. Co. Ltd., Chungbuk, South Korea
Volume :
2
fYear :
1997
fDate :
25 -30 May 1997
Firstpage :
697
Abstract :
Arc spray method has been widely used as contact layer forming method for lead welding in metallized film capacitor. The materials used as contact layer are Zn and Zn-Sn alloy etc. Metallized film capacitor show the change of electrical properties, particularly, equivalent series resistance (E.S.R) and dissipation factor (tan δ) with spray conditions of spray air pressure, material feeding speed and applied voltage. In this study, morphology, size and temperature of sprayed particles were measured and their effects on electrical properties were investigated. The size of particles is about 50 μm to 80 μm and the shapes of many particles is irregular form. The uniform small particles sprayed at 4bar were deposited densely, therefore, the capacitors made of these particles had low equivalent series resistance and low dissipation factor. After withstand current test, the capacitors with contact layer of smaller particle size show the smaller change of capacitance and dissipation factor
Keywords :
capacitors; metallisation; plasma arc spraying; Zn; Zn-Sn; arc spray preparation; capacitance; dissipation factor; electrical properties; equivalent series resistance; lead welding; metal contact layer; metallized film capacitor; particle morphology; particle size; withstand current; Capacitors; Contacts; Electric resistance; Inorganic materials; Metallization; Morphology; Spraying; Voltage; Welding; Zinc;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on
Conference_Location :
Seoul
Print_ISBN :
0-7803-2651-2
Type :
conf
DOI :
10.1109/ICPADM.1997.616531
Filename :
616531
Link To Document :
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