Title :
An equivalent model of TSV silicon interposer
Author :
An Tong ; Qin Fei ; Wu Wei ; Yu Daquan ; Wan Lixi ; Wang Jun
Author_Institution :
Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China
Abstract :
The silicon layer containing through silicon vias (TSVs) is considered as anisotropic fiber reinforced composite layer with different longitudinal and transversal properties. An analytical approach is presented to estimate the effective Young´s modulus, Poisson´s ratio and coefficient of thermal expansion (CTE) for composite layer. It shows that the TSVs have no significant influence on the deflection of silicon layer, and the model ignoring TSVs is capable to predict enough accurate deflection of silicon layer.
Keywords :
Young´s modulus; elemental semiconductors; fibre reinforced composites; integrated circuit modelling; silicon; thermal expansion; three-dimensional integrated circuits; CTE; Poisson ratio; Si; TSV silicon interposer equivalent model; anisotropic fiber reinforced composite layer; coefficient of thermal expansion; effective Young´s modulus; longitudinal properties; silicon layer deflection; through silicon vias; transversal properties; Abstracts; Copper;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474687
