Comparative analysis of reliability between dual-row and conventional QFN packages

Author

Guofeng Xia ; Fei Qin ; Wenhui Zhu ; Xiaobo Ma ; Cha Gao

Author_Institution

Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

616

Lastpage

619

Abstract

The reliability of novel Quad Flat No-Lead (QFN) package design with multi-row lead fingers has not been well analyzed yet. The thermal characterization, warpage performance and board level solder joint reliability of dual-row and conventional QFN packages are investigated in this paper for comparison. Flotherm Computational Fluid Dynamics (CFD) software is employed to predict the package thermal performance. Warpage performance is studied by FE modeling, and correlates with analytical results from Timoshenko´s bi-layer beam model. In board level solder joint reliability comparison study, 3D-Quarter finite element (FE) model, steady-state creep hyperbolic sine constitutive model for SnAgCu solder and Zhu´s energy based fatigue model are used. The results show that thermal performance and board level solder joint fatigue life of conventional QFN are slightly greater than that of dual-row QFN. Warpage results based on bi-layer beam theory basically agree with FE modeling results.

Keywords

computational fluid dynamics; electronics packaging; finite element analysis; reliability; silver compounds; solders; tin compounds; 3D-quarter finite element model; CFD software; FE modeling; QFN package; SnAgCu; bilayer beam model; board level solder joint fatigue life; board level solder joint reliability; dual-row package; energy based fatigue model; flotherm computational fluid dynamics software; multirow lead finger; package thermal performance prediction; quad flat no-lead package design; steady-state creep hyperbolic sine constitutive model; thermal characterization; warpage performance; Abstracts; Materials; Physics; Dual-row QFN; Fatigue Life; Thermal Performance; Warpage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474693

Filename

6474693