Mechanical reliability characterization of 3D package

More high functionality and high speed are required for electronic devices. In order to fulfill such requirements, 3D integrated package (3DPKG) technologies have been developed with TSV technologies for chip stacks and/or package stacks technologies like package-on-package (POP) which enable high density mount as well as high speed data transmission. 3DPKGs are usually micro-fabricated with several materials. In this case, reliability issues are contributed by multi sets of material but not only by single material. For this reason, analysis of material properties impacts to reliability on 3DPKGs is important. In this report, we had put our focus on the warpage which was most important for 3DPKG reliability, moreover analyzed relations between warpage and various material properties for packages with Cu pillar by the Finite element method (FEM). As a result, we show material solutions to reduce the warpage on 3DPKGs.