• DocumentCode
    3504089
  • Title

    Study on characteristics of thermal flow sensor designed by different shape model

  • Author

    Youngbae Jeon ; Sheng Liu

  • Author_Institution
    Sch. of Mech. Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    641
  • Lastpage
    645
  • Abstract
    The present paper is focused on the characteristics study of thermal flow sensors in different shapes. Based on the thermal flow sensor design theory, a series of thermal flow sensors with different shapes were developed. Compared with the existing model, the sensitivity of the curve design was also studied through thermal analysis. The results reveal different temperature distributions in different design models. The finite element method (FEM) was also adopted to study thermal distribution of micro-electro mechanical systems (MEMS) sensor, and the result is in great agreement with that of numerical method.
  • Keywords
    finite element analysis; flow sensors; microsensors; temperature distribution; temperature sensors; thermal analysis; FEM; MEMS sensor; curve design sensitivity; finite element method; microelectromechanical system sensor; numerical method; shape model; temperature distributions; thermal analysis; thermal flow sensor characteristics; thermal flow sensor design theory; Abstracts; Annealing; Heating; Silicon compounds; Temperature sensors; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474699
  • Filename
    6474699