Title :
The influences of coating alumina on the RF characteristics of packaged surface acoustic wave devices
Author :
Zheng-dong Liu ; Cheng Zhao
Author_Institution :
Sch. of Phys. Sci. & Technol., Yangzhou Univ., Yangzhou, China
Abstract :
This paper presents studies on the influences of alumina film overly coated on the chip surface on the RF characteristics of surface acoustic wave (SAW) devices during packaging process. An SAW resonator is taken as an example and the surface layer deformation of the chip substrate with different thicknesses of alumina overlay is simulated based on finite element method (FEM). The RF characteristics of the packaged devices in different cases are compared. The results show the overlay of appropriate thickness can improve the package effect on SAW devices.
Keywords :
alumina; coatings; electronics packaging; finite element analysis; surface acoustic wave resonators; FEM; RF characteristics; SAW devices; SAW resonator; alumina film; alumina overlay; chip substrate; chip surface; coating alumina; finite element method; packaged surface acoustic wave devices; packaging process; surface layer deformation; Abstracts; Educational institutions; Films; Micromechanical devices; Performance evaluation; Resonant frequency; Substrates;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474707
