• DocumentCode
    3504516
  • Title

    Implantation dynamics of plasma immersion ion implantation into non-conductive materials and applications

  • Author

    Fu, R.K.Y. ; Tian, X.B. ; Chu, Paul K.

  • Author_Institution
    Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Kowloon, China
  • fYear
    2004
  • fDate
    1-1 July 2004
  • Firstpage
    238
  • Abstract
    Summary form only given. Non-conductive materials such as dielectrics, polymers and ceramics are widely used in the industry. Many techniques have been developed to enhance the surface properties and extend the applications of these materials. The use of plasma immersion ion implantation (PIII) on non-conductive materials is investigated via theoretical and experimental means. Computer simulation is utilized to model the implantation dynamics of the plasma sheath, surface potential, surface charge distribution, ion implant dose, implant uniformity, and other parameters and factors during PIII of insulators. Systematic experiments is also conducted to evaluate the effects of various plasma parameters and placement configurations on the sample properties and implantation efficacy. Our results show that in general, a low plasma density and short-pulse mode are preferred as there is less surface charging, a smaller potential drop on the sample surface, and a thinner plasma sheath. Based on findings in our studies, gases and metals have been implanted into some non-conductive materials to improve their surface energy, conductivity, mechanical and tribological properties. These empirical results is presented as well.
  • Keywords
    ceramics; dielectric materials; digital simulation; plasma density; plasma immersion ion implantation; plasma sheaths; polymers; surface charging; surface conductivity; surface energy; surface potential; surface treatment; tribology; ceramics; computer simulation; conductivity; dielectric materials; insulators; ion implant dose; mechanical properties; nonconductive materials; plasma density; plasma immersion ion implantation dynamics; plasma sheath; polymers; potential drop; surface charge distribution; surface charging; surface energy; surface potential; surface properties; tribological properties; Ceramics; Conducting materials; Dielectric materials; Implants; Plasma density; Plasma immersion ion implantation; Plasma properties; Plasma sheaths; Polymers; Surface charging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2004. ICOPS 2004. IEEE Conference Record - Abstracts. The 31st IEEE International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-8334-6
  • Type

    conf

  • DOI
    10.1109/PLASMA.2004.1339857
  • Filename
    1339857