DocumentCode :
3504521
Title :
Hybrid modeling and analysis on the interfacial characteristics of Cu/Al interface structures in IC packaging with wire bonding
Author :
Liqiang Zhang ; Dongjing Liu ; Min Chen ; Fangwei Xie ; Xingang Yu ; Xifu Song ; Tao Xi ; Yanfang Zhao ; Ping Yang
Author_Institution :
Lab. of Span-scale Design & Manuf. for MEMS/NEMS/OEMS, Jiangsu Univ., Zhenjiang, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
731
Lastpage :
734
Abstract :
With the development of micro/nano electronic technology and the miniaturization of IC (Integrated Circuit) packaging, the interfacial characteristics of the nanoscale interface structure in IC packaging become more and more serious on the whole performance of IC or devices. The aim of this article is to put forward a hybrid scale method to evaluate the interfacial thermal characteristics of the Cu/Al interface structure in IC packaging with Cu wires and Al pads. In this hybrid method, the EAM (Embedded Atom Method) potential is used to describe the Cu and Al atoms; the LJ (Lennard-Jones) potential is used to describe the Van der Waals force between Cu and Al atoms in MD (Molecular Dynamics) simulation at the nanoscale situation; meanwhile, the FE (Finite Element) and ISE (Interface Stress Element) are used to calculate the performance in the Micro/macroscales. It supplies a hybrid method to evaluate the interfacial properties in the IC packaging, which is helpful to design and manufacture of IC assembly.
Keywords :
aluminium; copper; finite element analysis; integrated circuit packaging; lead bonding; van der Waals forces; Cu-Al; EAM; ISE; LJ potential; Lennard-Jones potential; MD simulation; Van der Waals force; embedded atom method; finite element method; integrated circuit assembly; integrated circuit packaging; interface stress element; interfacial characteristics; microelectronic technology; molecular dynamics simulation; nanoelectronic technology; nanoscale interface structure; wire bonding; Artificial intelligence; Iron; Nanoscale devices; Packaging; Silicon; Stress; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474719
Filename :
6474719
Link To Document :
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