Thermal simulation for the packaging structures of Radio frequency power amplifier chamber

Rf power amplifier (Radio frequency power amplifier) has an important role in the military field due to its unique advantage. However,the Rf power amplifier devices will produce a large quantity of heat when they are working. The heat for the influence of the device is bigger, so the strict thermal design needs to be used on its Rf Power amplifier packages. There are 15 chips in body cavity of Rf Power amplifier, and lts total heat consumption is 14.254W. Six CHA1077 (0.465 W) chips, two CHU2277 (1.192 W) chips, two CHX1094 (0.54 W) chips and one CGY2137 (1.6 W) chip are packaged in Radio frequency body cavities. Its total heat consumption is 7.854 W. In power amplifier, there are four CGY2137 (1.6W) chips and its total heat consumption is 6.4 W. Preliminary design proved: only rely on heat transfer can´t meet the requirement, so forced air cooling must be adopted to. Refer to the design space and air volume requirements, the type of EBMPAPST 618NN fan has been chosen for module cooling. The heat dissipation way of the fan is air blow. The 3D models of Rf power amplifier has been established. It is working continuously not less than 24 hours, and after 1 hour, it has been basically working in a stable state. So only the steady temperature field distribution needs to be calculated in order to catch the internaI chips temperature distribution of the modules cavity body. Rf power amplifier cavities work environment temperature is 55 °C. The simulation results show that the maximum temperature in the Rf power amplifier is 71.2 °C. Only 16.2 °C maximum temperature raised in the module, and the maximum temperature field regional happened in radio frequency cavity around the CGY2137 chip. Due to the demand of the maximum temperature of the module no more than 90 °C, so this design completely meet the requirements.