Title :
Design and analysis of 2D embedded passive devices in printed circuit boards
Author :
Jing Zhang ; Baoxia Li ; Lixi Wan ; Liqiang Cao
Author_Institution :
Inst. of Microelectron., Beijing, China
Abstract :
Embedded passives devices are becoming increasingly important for next generation miniaturized systems. A Printed circuit boards (PCBs) is investigated in this paper with focus on passive devices. Film resistance, capacitance and inductance are embedded into the same board. The effects of embedded capacitors and inductance on signal integrity (SI) and electromagnetic compatibility (EMC) have been simulated, measured , and compared with measured results derived from conventional discrete capacitors. A finite element, full-wave method was used to simulate and analyze the transmission characteristics.
Keywords :
capacitors; electromagnetic compatibility; finite element analysis; passive networks; printed circuits; 2D embedded passive device analysis; EMC; PCB; discrete capacitors; electromagnetic compatibility; embedded capacitors; film resistance; finite element full-wave method; next generation miniaturized systems; printed circuit boards; signal integrity; transmission characteristic analysis; Abstracts; Capacitors; Inductance; Inductors; Materials; Resistance; Resistors;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474722
