Analysis and reduction of simultaneous switching noise in multi-layer package substrate

The physical model of one kind of Land Grid Array (LGA) packages is built and the simultaneous switching noise (SSN) in multi-layer package substrate is analyzed. The decoupling capacitors are adopted to reduce the SSN in this design. By using of the frequency domain simulation tools, the S-parameters of signal traces and bonding wires are obtained, which further are used as their models for time domain simulation. With these models of packaging interconnect structures and other driver models, the SSN is simulated by circuit simulation tools HSpice. According to the time domain simulation waveforms, the location and the values of the designed decoupling capacitors are optimized. The final simulation results show that the SSN has been significantly suppressed with the proposed method.