Title :
Simulation of IMC layer growth and Cu consumption in Sn-Ag-xCu/Cu solder joints during reflow
Author :
Xiaohui Wang ; Mingliang Huang ; Fan Yang ; Ning Zhao
Author_Institution :
Sch. of Mater. Sci. & Eng., Dalian Univ. of Technol., Dalian, China
Abstract :
A mathematical model that can well describe the kinetics of liquid/solid reaction between Sn-Ag-Cu solder balls and Cu substrates was developed in this study. The Cu consumption and the intermetallic compound (IMC) thickness as functions of reflow time for solder balls with different volumes and initial Cu concentrations were obtained from the model. Multiphysics finite element (FE) software was applied to solve the equations and visualize the numerical results. Furthermore, Sn-3.5Ag and Sn-3.0Ag-0.5Cu solder balls with different sizes (200, 300, 400, and 500 μm in diameter) were employed to react with Cu pads for various reflow times. The experimental measurements were compared with the simulated results and good consistency was obtained.
Keywords :
copper; finite element analysis; silver compounds; solders; tin compounds; IMC layer growth simulation; Sn-Ag-Cu; copper consumption; intermetallic compound thickness; liquid-solid reaction; mathematical model; multiphysics finite element software; reflow; size 200 mum; size 300 mum; size 400 mum; size 500 mum; solder ball; solder joint; Abstracts;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474737
