Simulation of IMC layer growth and Cu consumption in Sn-Ag-xCu/Cu solder joints during reflow

Author

Xiaohui Wang ; Mingliang Huang ; Fan Yang ; Ning Zhao

Author_Institution

Sch. of Mater. Sci. & Eng., Dalian Univ. of Technol., Dalian, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

823

Lastpage

827

Abstract

A mathematical model that can well describe the kinetics of liquid/solid reaction between Sn-Ag-Cu solder balls and Cu substrates was developed in this study. The Cu consumption and the intermetallic compound (IMC) thickness as functions of reflow time for solder balls with different volumes and initial Cu concentrations were obtained from the model. Multiphysics finite element (FE) software was applied to solve the equations and visualize the numerical results. Furthermore, Sn-3.5Ag and Sn-3.0Ag-0.5Cu solder balls with different sizes (200, 300, 400, and 500 μm in diameter) were employed to react with Cu pads for various reflow times. The experimental measurements were compared with the simulated results and good consistency was obtained.

Keywords

copper; finite element analysis; silver compounds; solders; tin compounds; IMC layer growth simulation; Sn-Ag-Cu; copper consumption; intermetallic compound thickness; liquid-solid reaction; mathematical model; multiphysics finite element software; reflow; size 200 mum; size 300 mum; size 400 mum; size 500 mum; solder ball; solder joint; Abstracts;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474737

Filename

6474737