Vibration and drop analysis of 3D SiP with Through Silicon Via

3D System in Package with Through Silicon Via has been a promising solution to enhance the integrated density. However, as more and more devices are integrated in one package, the reliability and performance is affected by the work environment, such as temperature variation, vibration, drop and so on. Many researches has been done on the drop analysis of solder ball on the PCB substrate, but few vibration and drop analysis on the Micro-bump of Through Silicon Via related to the practical fabrication process and size has been proposed. In this paper, the vibration and drop reliability of solder ball and Micro-bump is analyzed, respectively, with the practical process and real size taken into account. The affect of structure and size of 3D package with Through Silicon Via is studied, such as the design of the whole package, the Through Silicon Via distribution, size and so on.