Millimeter-wave performance of various interconnections used for Si-based IC packaging technologies

In this paper, we will discuss the mmW performance of ribbon bonding and wire-bonding with different feature sizes and configurations on low temperature co-fired ceramics (LTCC). The impacts of the bonding wire diameter, gap, quantities, and wire loop are also the primary concern. Last but not least, this paper will give readers a comprehensive comparison of mmW performance between different interconnection techniques for the emerging Si-based mmW packaging.