Title :
Millimeter-wave performance of various interconnections used for Si-based IC packaging technologies
Author :
Jie Cui ; Qidong Wang ; Guidotti, Daniel ; Liqiang Cao ; Lixi Wan
Author_Institution :
Inst. of Microelectron., Beijing, China
Abstract :
In this paper, we will discuss the mmW performance of ribbon bonding and wire-bonding with different feature sizes and configurations on low temperature co-fired ceramics (LTCC). The impacts of the bonding wire diameter, gap, quantities, and wire loop are also the primary concern. Last but not least, this paper will give readers a comprehensive comparison of mmW performance between different interconnection techniques for the emerging Si-based mmW packaging.
Keywords :
ceramic packaging; integrated circuit interconnections; integrated circuit packaging; lead bonding; millimetre wave circuits; millimetre wave integrated circuits; IC packaging; LTCC; interconnections; low temperature co-fired ceramics; millimeter-wave performance; mmW packaging; ribbon bonding; wire bonding; Abstracts; CMOS integrated circuits; Dielectrics; Facsimile; Packaging; Radio frequency; Semiconductor device modeling;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474740
