Abstract :
The following topics are dealt with: advanced packaging and system integration; packaging materials; packaging design and modelling; advanced manufacturing technologies and packaging equipment; quality and reliability; and solid state lighting packaging.
Keywords :
electronics packaging; lighting; reliability; advanced manufacturing technologies; advanced packaging; electronic packaging technology; high density packaging; packaging equipment; packaging materials; reliability; solid state lighting packaging; system integration;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474746
