Title :
Compliant pin interconnect challenging and reliability after RoHS exemption
Author :
He, Dawei ; Yu Xiang ; Chung, D.F. ; Wang, Peng ; Hu, Lei ; Dayal, B. ; Sauter, K. ; Norman, Timothy ; Martinez-Vargas, J.
Author_Institution :
MiTAC USA, Fremont, CA, USA
Abstract :
The RoHS exemption for tin/lead coating on compliant pin connectors will be lifted after Jan 1, 2013. The compliant pin connector´s manufacture process in motherboard assembly becomes more and more challenging with the conversion to lead-free pin plating. Literature on the pin plating process focused mainly on matte tin finish, compliant pin connectors are not immune to the bent pin and hole wall broken defect even with relatively tin/lead plating process. In this study, a test vehicle will be designed with specific focus on different compliant pin plating characteristics, different PCB drill hole size (DHS), and different motherboards´ surface finish. Then the relevant design and materials characteristics correlate with the failure mode of compliant pin press process will be elaborated. Finally, potential solution which will be evaluated and characterized to eliminate the contact defect in compliant pin press process and interconnect reliability will be concluded.
Keywords :
RoHS compliance; electric connectors; electronics packaging; failure analysis; printed circuit interconnections; reliability; surface finishing; DHS; PCB drill hole size; RoHS exemption; bent pin; compliant pin connector manufacture process; compliant pin interconnect reliability; compliant pin plating characteristics; compliant pin press process; contact defect elimination; failure mode; hole wall broken defect; lead-free pin plating process; materials characteristics; matte tin finish; motherboard assembly; motherboard surface finish; reliability; test vehicle; tin-lead coating process; Abstracts; Connectors; Lead; DHS; FHS; compliant pin; lead-free; plating; press fit; surface finish;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474757