Title :
Ceramic column grid array: A high-reliability approach for area array packaging
Author :
Yingzhuo Huang ; Xueming Jiang ; Pengrong Lin ; Yusheng Cao ; Binhao Lian ; Quanbin Yao
Author_Institution :
Beijing Microelectron. Technol. Inst., Beijing, China
Abstract :
Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect, and to achieve a significant increase in reliability. This paper introduced a technology of CCGA package with LGA717 substrate, it specifically discussed the coplanarity, the void rate and the solder joint strength. By design of the daisy-chain substrate, the board-level reliability of the CBGA and CCGA packages were investigated. The CCGA components had longer life than that of the CBGA components.
Keywords :
ceramic packaging; reliability; solders; CCGA components; CCGA package; LGA717 substrate; area array packaging; board-level reliability; ceramic column grid array package; daisy-chain substrate; flexible interconnect; high-reliability approach; solder joint strength; Abstracts; Commercialization; Cooling; Joints; Packaging; Reliability; Soldering;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474760
