Finite element analysis of wire clamp for wire bonding

Wire clamp is used in the wire bonding process to grip and release the gold wire for forming loop profile in 1-2 milliseconds. Large opening and high response frequency are the mainly two factors for wire clamp design. To research the feature of wire clamp, a finite-element model was developed to calculate the amplification ratio and nature frequency. Results show that piezoelectric actuated wire clamp has a high resonant frequency of over 1000 Hz and an opening of over 80 μm. The effect of geometry parameters on the amplification ratio was also studied based on the finite-element model, and length of arm was found as the major factor. This research is useful for wire clamp design and optimization.