DocumentCode :
3505579
Title :
A thick film accelerometer based on LTCC-technology
Author :
Shichao Guo ; Min Miao ; Runiu Fang ; Duwei Hu ; Yufeng Jin
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
990
Lastpage :
992
Abstract :
This paper reports a thick film accelerometers based on LTCC technology. The authors introduce a LTCC compatible design and develop a fabrication process flow of this new kind of accelerometer, and moreover, samples for testing are fabricated. It is designed as a piezoresistive accelerometer, which consists of a proof mass, two parallel leaf springs, and a fixed frame. The sensing device may be embedded in the LTCC substrate. The piezoresistive signals are transmitted through LTCC multilayer interconnection and input to a DC amplifier which is surface-mounted to the substrate. The mechanical and electrical characterizations have been accomplished by simulation.
Keywords :
DC amplifiers; accelerometers; piezoresistive devices; thick film devices; DC amplifier; LTCC compatible design; LTCC multilayer interconnection; LTCC substrate; LTCC technology; accelerometer; electrical characterization; fabrication process flow; fixed frame; mechanical characterization; parallel leaf springs; piezoresistive accelerometer; piezoresistive signals; sensing device; thick-film accelerometer; Accelerometers; Actuators; Nonhomogeneous media; Piezoresistive devices; Springs; Strain; Substrates; Accelerometer; LTCC; Thick-film Process; piezoresistive; simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474772
Filename :
6474772
Link To Document :
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