DocumentCode
3505615
Title
Thick film resistors on alumina substrate as sensing elements
Author
Xiaojie Chen ; Zongyang Zhang ; Sheng Liu
Author_Institution
State Key Lab. for Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2012
fDate
13-16 Aug. 2012
Firstpage
997
Lastpage
999
Abstract
In this paper, thick film resistors (TFRs) on alumina substrate for strain sensor applications have been developed and evaluated. Thick film technology based ceramic pressure sensors (CPS) are fabricated by screen printing and firing four TFRs on a machined circular diaphragm and then the TFRs are connected in a Wheatstone bridge configuration. Finite element method (FEM) is used to optimize structural design and predict the optimal position where the piezoresistive TFRs are placed on the ceramic diaphragm. Preliminary tests show that the sensors exhibit a linearity of 0.4% full-scale (FS), the hysteresis and repeatability are 0.5% FS. Moreover, the thermal zero drifts and thermal sensitivity drifts of the sensors in the whole temperature range (-40 °C to 125 °C) are less than 3% FS. These results indicate that the sensor is a cost-effective choice for many application fields especially in automotive field.
Keywords
alumina; diaphragms; finite element analysis; pressure sensors; printing; strain sensors; substrates; thick film resistors; CPS; FEM; TFR; Wheatstone bridge configuration; alumina substrate; automotive field; ceramic diaphragm; ceramic pressure sensors; finite element method; machined circular diaphragm; optimal position prediction; piezoresistive TFR; screen printing; sensing elements; sensor thermal sensitivity drifts; sensor thermal zero drifts; strain sensor application; structural design optimization; temperature -40 degC to 125 degC; thick film resistors; thick film technology; Abstracts; Ceramics; Educational institutions; Strain; Thermal sensors; Alumina; Pressure sensor; Thick film resistor;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4673-1682-8
Electronic_ISBN
978-1-4673-1680-4
Type
conf
DOI
10.1109/ICEPT-HDP.2012.6474774
Filename
6474774
Link To Document