DocumentCode :
3505639
Title :
THz filters embedded in LTCC multi-layer substrate
Author :
Xiaoqing Zhang ; Min Miao ; Zhensong Li ; Yuexia Zhang ; Yanzhu Lv ; Yating Yao
Author_Institution :
Inf. Microsyst. Inst., Beijing Inf. Sci. & Technol. Univ., Beijing, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
1003
Lastpage :
1005
Abstract :
In the past decade, with the introduction of multi-layer low-temperature co-fired ceramic (LTCC) technology, terahertz(THz) filters embedded in multi-layer LTCC substrates, are shown to be promising in many applications of the microwave communication domain. This paper proposes two sub-millimeter wave filters and one THz band-pass filter designs based on waveguides and elements. They are rectangular bandpass filters featuring coupling cavity, metal posts and the combination of both metal posts and coupling cavity respectively. The simulation results of the three bandpass filters show that, these filters which innovatively make uses of rectangular waveguide structures embedded in multi-layer LTCC substrate, metal posts and coupling cavities, may meet the designing target and may function well in sub-millimeter wave or THz bands.
Keywords :
band-pass filters; ceramics; multilayers; radiocommunication; rectangular waveguides; submillimetre wave filters; substrates; waveguide filters; LTCC multilayer substrate; LTCC technology; THz band-pass filter designs; THz bands; THz filters; coupling cavity; designing target; microwave communication domain; multilayer LTCC substrates; multilayer low-temperature co-fired ceramic technology; rectangular bandpass filters; rectangular waveguide structures; submillimeter wave filters; terahertz filters; waveguides; Ceramics; Metals; Noise; Optimization; Passband; Pins; Substrates; Bandpass Filter; Low Temperature Cofired Ceramic (LTCC); Sub-Millimeter Wave; Terahertz;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474776
Filename :
6474776
Link To Document :
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