DocumentCode
3505639
Title
THz filters embedded in LTCC multi-layer substrate
Author
Xiaoqing Zhang ; Min Miao ; Zhensong Li ; Yuexia Zhang ; Yanzhu Lv ; Yating Yao
Author_Institution
Inf. Microsyst. Inst., Beijing Inf. Sci. & Technol. Univ., Beijing, China
fYear
2012
fDate
13-16 Aug. 2012
Firstpage
1003
Lastpage
1005
Abstract
In the past decade, with the introduction of multi-layer low-temperature co-fired ceramic (LTCC) technology, terahertz(THz) filters embedded in multi-layer LTCC substrates, are shown to be promising in many applications of the microwave communication domain. This paper proposes two sub-millimeter wave filters and one THz band-pass filter designs based on waveguides and elements. They are rectangular bandpass filters featuring coupling cavity, metal posts and the combination of both metal posts and coupling cavity respectively. The simulation results of the three bandpass filters show that, these filters which innovatively make uses of rectangular waveguide structures embedded in multi-layer LTCC substrate, metal posts and coupling cavities, may meet the designing target and may function well in sub-millimeter wave or THz bands.
Keywords
band-pass filters; ceramics; multilayers; radiocommunication; rectangular waveguides; submillimetre wave filters; substrates; waveguide filters; LTCC multilayer substrate; LTCC technology; THz band-pass filter designs; THz bands; THz filters; coupling cavity; designing target; microwave communication domain; multilayer LTCC substrates; multilayer low-temperature co-fired ceramic technology; rectangular bandpass filters; rectangular waveguide structures; submillimeter wave filters; terahertz filters; waveguides; Ceramics; Metals; Noise; Optimization; Passband; Pins; Substrates; Bandpass Filter; Low Temperature Cofired Ceramic (LTCC); Sub-Millimeter Wave; Terahertz;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4673-1682-8
Electronic_ISBN
978-1-4673-1680-4
Type
conf
DOI
10.1109/ICEPT-HDP.2012.6474776
Filename
6474776
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