• DocumentCode
    3505639
  • Title

    THz filters embedded in LTCC multi-layer substrate

  • Author

    Xiaoqing Zhang ; Min Miao ; Zhensong Li ; Yuexia Zhang ; Yanzhu Lv ; Yating Yao

  • Author_Institution
    Inf. Microsyst. Inst., Beijing Inf. Sci. & Technol. Univ., Beijing, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    1003
  • Lastpage
    1005
  • Abstract
    In the past decade, with the introduction of multi-layer low-temperature co-fired ceramic (LTCC) technology, terahertz(THz) filters embedded in multi-layer LTCC substrates, are shown to be promising in many applications of the microwave communication domain. This paper proposes two sub-millimeter wave filters and one THz band-pass filter designs based on waveguides and elements. They are rectangular bandpass filters featuring coupling cavity, metal posts and the combination of both metal posts and coupling cavity respectively. The simulation results of the three bandpass filters show that, these filters which innovatively make uses of rectangular waveguide structures embedded in multi-layer LTCC substrate, metal posts and coupling cavities, may meet the designing target and may function well in sub-millimeter wave or THz bands.
  • Keywords
    band-pass filters; ceramics; multilayers; radiocommunication; rectangular waveguides; submillimetre wave filters; substrates; waveguide filters; LTCC multilayer substrate; LTCC technology; THz band-pass filter designs; THz bands; THz filters; coupling cavity; designing target; microwave communication domain; multilayer LTCC substrates; multilayer low-temperature co-fired ceramic technology; rectangular bandpass filters; rectangular waveguide structures; submillimeter wave filters; terahertz filters; waveguides; Ceramics; Metals; Noise; Optimization; Passband; Pins; Substrates; Bandpass Filter; Low Temperature Cofired Ceramic (LTCC); Sub-Millimeter Wave; Terahertz;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474776
  • Filename
    6474776