Topology optimization of swing-arm in LED die bonder

Author

Meifa Huang ; Dawei Zhang ; Zhiyue Wang ; Weichuang Quan

Author_Institution

Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

1006

Lastpage

1009

Abstract

With the development of packaging technology, LED lighting technology is widely used. The accuracy of die bonding in LED packaging equipment directly influences the bonding quality of LED. The swing-arm is an important component in LED die bonder and its dynamic characteristics directly affects the piece accuracy. The accuracy and efficiency of LED die bonder are limited because of the vibration of the swing-arm. In this paper, the topology optimization of the swing-arm is analyzed by using the analysis software ANSYS. The optimized structure of swing-arm is obtained by topology optimization. The stiffness of the swing-arm is improved.

Keywords

elasticity; electronics packaging; light emitting diodes; microassembling; packaging machines; vibrations; ANSYS analysis software; LED die bonder accuracy; LED die bonder efficiency; LED lighting technology; LED packaging equipment; bonding quality; dynamic characteristics; packaging technology; swing-arm stiffness; swing-arm topology optimization; swing-arm vibration; Abstracts; Bonding; Computational modeling; Light emitting diodes; Manganese; Optimization; Topology; ANSYS analysis; Die bonding equipment; Swing-arm; Topology optimization;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474777

Filename

6474777