Title :
Mechanism design and dynamic simulation of die bonding machines
Author :
Zhanlun Cao ; Xiaohong Wu ; Jian Gao ; Yongjun Jiang ; Xin Chen
Author_Institution :
Sch. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China
Abstract :
Because die-bonding mechanism is precision machinery, the high-speed bonding head must be meet designed displacement and the force must be kept within a certain range. In this paper, a 3D model of a bonding mechanism was designed and implemented within SolidWorks® software, and analyzed dynamically in ADAMS® software. Through the motion simulation to designed velocity, the displacement curve and the bonding force curve were obtained. The graphs yielded by simulating show that the movement and the bonding force of the pick-up head meet the design criterion and the die attach process of a die bonder. Based on the analysis result, a die bonding machine is designed and manufactured.
Keywords :
design engineering; microassembling; production engineering computing; production equipment; solid modelling; 3D model; ADAMS software; SolidWorks software; bonding force; bonding mechanism design; design criterion; designed displacement; die attach process; die bonder; die bonding machines; displacement curve; dynamic simulation; high-speed bonding head; motion simulation; pick-up head; precision machinery; Bonding; Force; Multi-layer neural network; Out of order; Shape; Stress; Vectors; ADAMS; Bonding mechanism; Rigid-flexible coupling; Simulation and Analysis;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474778
