Mechanism design and dynamic simulation of die bonding machines

Author

Zhanlun Cao ; Xiaohong Wu ; Jian Gao ; Yongjun Jiang ; Xin Chen

Author_Institution

Sch. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

1010

Lastpage

1013

Abstract

Because die-bonding mechanism is precision machinery, the high-speed bonding head must be meet designed displacement and the force must be kept within a certain range. In this paper, a 3D model of a bonding mechanism was designed and implemented within SolidWorks^® software, and analyzed dynamically in ADAMS^® software. Through the motion simulation to designed velocity, the displacement curve and the bonding force curve were obtained. The graphs yielded by simulating show that the movement and the bonding force of the pick-up head meet the design criterion and the die attach process of a die bonder. Based on the analysis result, a die bonding machine is designed and manufactured.

Keywords

design engineering; microassembling; production engineering computing; production equipment; solid modelling; 3D model; ADAMS software; SolidWorks software; bonding force; bonding mechanism design; design criterion; designed displacement; die attach process; die bonder; die bonding machines; displacement curve; dynamic simulation; high-speed bonding head; motion simulation; pick-up head; precision machinery; Bonding; Force; Multi-layer neural network; Out of order; Shape; Stress; Vectors; ADAMS; Bonding mechanism; Rigid-flexible coupling; Simulation and Analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474778

Filename

6474778