DocumentCode :
3505690
Title :
Optimal design of work stage mounting system of precision packaging equipment
Author :
Hui Jing ; Cong Li ; Fuyun Liu ; Bing Kuang
Author_Institution :
Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
1015
Lastpage :
1018
Abstract :
High precision packaging equipments need high precision isolator to reduce the vibration transmission from outside to work stage. Nowadays, a useful and effective way for vibration isolating is to employ the proper mounting systems to reduce the vibration. One useful method for helping the design engineer to develop more effective mounting systems is through optimization techniques. Sequential Quadratic Programming (SQP) is an effective optimization technique in many engineering fields. In this paper, design optimization of work stage mounting system based on SQP method for vibration control is presented. The optimization objective is to find the highest decoupling ratio of the each mount while selecting the stiffness and orientations of individual mount. The constraints are imposed to keep the desired decoupled ratio in each orientation and the frequency corresponding to the decoupled ratio. A case study is given to validate the proposed method. The result shows that the value of optimized system, such as decoupling ratio, is improved significantly. Therefore, the method proposed in this paper is effective for the optimization of work stage mounting system.
Keywords :
design engineering; elasticity; packaging machines; precision engineering; quadratic programming; vibration isolation; SQP method; decoupling ratio; high-precision isolator; high-precision packaging equipments; optimal design; optimization techniques; orientation selection; sequential quadratic programming; stiffness selection; vibration control; vibration isolation; vibration transmission reduction; work stage mounting system; Abstracts; Acceleration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474779
Filename :
6474779
Link To Document :
بازگشت