Research on thermal field of giant magnetostrictive jetting dispenser

Author

Pengfei Dan ; Can Zhou ; Shijun Zhang ; Guiling Deng

Author_Institution

Nat. Key Lab. of High-performance & Complex Manuf., Central South Univ., Changsha, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

1019

Lastpage

1022

Abstract

In order to enhance the performance and stability of the injection valve, it is necessary to know the dynamic change of the thermal field in working process of the giant magnetostrictive injection valve. In this paper, thermal field finite element analysis (FEA) including the contact resistance and experiment were carried out. A little difference between simulation and experimental results shows that temperature field FEA including contact thermal resistance can reflect the actual situation accurately. The temperature variation of the injection valve is little after 2500 seconds working. The steady thermal field can ensure injection valve working stably.

Keywords

contact resistance; finite element analysis; magnetic actuators; magnetostrictive devices; thermal resistance; contact thermal resistance; giant-magnetostrictive injection valve; giant-magnetostrictive jetting dispenser; injection valve performance; injection valve stability; steady thermal field; temperature field FEA; temperature variation; thermal field dynamic change; thermal field finite element analysis; time 2500 s; working process; Conductivity; Magnetostriction; Thermal analysis; Thermal conductivity; Thermal resistance; Valves;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474780

Filename

6474780