• DocumentCode
    3505771
  • Title

    Effects of sulfide on silver-plated lead frame on wire bonding quality

  • Author

    Zhang, H.M. ; Zong, Fenghua ; Hu, Minglie ; Ye, D.H. ; He, Q.C.

  • Author_Institution
    Freescale Semicond. (China) Ltd., Tianjin, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    1030
  • Lastpage
    1033
  • Abstract
    Copper lead frame with silver plated layer was widely used in the assembly industry and H2S (hydrogen sulfide) in air sulfurized the silver plated layer as well as formed Ag2S (silver sulfide) film which changed the surface topography of lead fingers and degraded the wire bonding ability. The control of storage environment and exposing time as well as the application of pre-wire-bonding plasma could bring benefits to the actual production.
  • Keywords
    hydrogen compounds; lead bonding; silver compounds; surface topography; Ag2S; H2S; assembly industry; lead fingers; prewire-bonding plasma; silver-plated lead frame; storage environment control; surface topography; wire bonding quality; Abstracts; Films; Gold; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474783
  • Filename
    6474783
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3505771