DocumentCode :
3505925
Title :
Critical variables in gaseous corrosion testing
Author :
Jeannotte, Dexter ; Biyani, Shriram ; Roth, John ; Hall, Larry ; Davies, Sue ; Vaughen, Bruce ; Steppan, James
Author_Institution :
IBM, Hopewell Junction, NY, USA
fYear :
1988
fDate :
26-29 Sept. 1988
Firstpage :
321
Lastpage :
325
Abstract :
In recent work at Vanderbilt University, a failure mode was characterized that is accelerated by the presence of hostile gases in the environment. The effect of the velocity of the hostile gas stream was tested. Three different gas velocities were evaluated by measurement of the time of development of a shorting failure over a range of electrical field strengths. It was found that the time to failure decreased in proportion to the square root of the gas velocity as velocity increased in the range of 4 mm/s to 400 mm/s. The electrolyte base was provided by a coating of polyethylene glycol, average molecular weight 400, PEG400, between the Cu electrodes. These results make it possible to relate the time to failure to application variables such as gas concentration and gas-flow velocity, thus making possible at estimate of product lifetime from test results.<>
Keywords :
copper; corrosion testing; electronic equipment testing; life testing; 4 to 400 mm/s; Cu electrodes; PEG400; SO/sub 2/ gas; Vanderbilt University; accelerated testing; air velocity; application variables; coating of polyethylene glycol; critical variables; electrolyte base; electrolytic metal migration; estimate of product lifetime; failure mode; gas concentration; gas test chamber; gas-flow velocity; gaseous corrosion testing; hostile gases; molecular weight 400; range of electrical field strengths; reliability; shorting failures; test results; Acceleration; Coatings; Corrosion; Electric variables measurement; Electrodes; Gases; Polyethylene; Testing; Time measurement; Velocity measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on
Conference_Location :
San Francisco, CA, USA
Type :
conf
DOI :
10.1109/HOLM.1988.16134
Filename :
16134
Link To Document :
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