Title :
The effect of voids on thermal conductivity of solder joints
Author :
Hailong Li ; Chunqing Wang ; Meng Yang ; Ningning Wang ; Rong An ; Yanjun Xu
Author_Institution :
State Key Lab. of Adv. Welding & Joining, Harbin Inst. of Technol., Harbin, China
Abstract :
In this paper, the influence of voids on thermal conductivity of solder joints is analyzed using the finite element method. The conclusions come that: for single-void case, with the size of void increasing, the influence of void on thermal conductivity growing, void near the heat source has a greater influence than that far away. Then, the situation of multi-voids get similar results, but the temperature distribution of solder joints presents the comprehensive function of the two factors, particularly, the voids far away from the heat source may have little influence on the thermal conducting performance.
Keywords :
finite element analysis; solders; thermal conductivity; voids (solid); finite element method; heat source; solder joints; temperature distribution; thermal conductivity; voids; Ceramics; Electronic packaging thermal management; Heat sinks; Heating; Joints; Thermal conductivity;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474790
