Failure mechanism diagnosis on plastic package integrated circuit basing on Fault Tree Analysis

Fault Tree Analysis (FTA) is the most commonly used technique for causal analysis in risk and reliability studies. In this paper, the failure mechanism of the plastic package integrated circuit (SRAM) was researched using fault tree analysis method. The failure mode of the plastic package integrated circuit (SRAM) was open, which was taken as the top event. The fault tree of the plastic package integrated circuit was built. The main cause leading to failure was analyzed basing on the fault tree. And cross section analysis was performed on the failed sample to validate the analysis result. And corresponding preventive measures could also be presented according as fault tree analysis.