Title :
Solderability of eco-friendly OSP surface finish
Author :
Shijun Lu ; Yeqing Tao ; Dongyan Ding ; Yu Hu
Author_Institution :
Electron. Assembly Processes & Mater., Corp. Technol., Siemens Ltd., Shanghai, China
Abstract :
In order to enhance the solderability, bare copper on PCBs needs a protection. As an antioxidant, OSP (Organic Solderability Preservatives) has been widely used in PCB surface finishes. The OSP surface finish is a very thin film. It is transparent, colorless and fragile. This makes it difficult to detect the OSP film and indicate the OSP surface solderability. In this work, a chemical reaction is possible for such a characterization. We use scanning electron microscopy to evaluate the reflow behavior of two kinds of high performance OSPs. Microstructural evolution of the OSPs related to the reflow process was investigated. Reflow atmosphere did not affect the OSP films. Reaction product of Ag crystals were found to be dendrite.
Keywords :
copper alloys; reflow soldering; scanning electron microscopy; OSP film; antioxidant; bare copper; crystal reaction product; eco-friendly OSP surface finish solderability; microstructural evolution; organic solderability preservatives; reflow atmosphere; reflow process; scanning electron microscopy;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474804
