• DocumentCode
    3506313
  • Title

    Investigation on electromigration failure of phase shifter

  • Author

    Zhenzhen Rao ; Shengxiang Bao ; Xiaowen Zhang ; Zuwen Wang ; Weiming Lai

  • Author_Institution
    State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    1141
  • Lastpage
    1144
  • Abstract
    Aiming at the problem of electric loss rises, the qualified and the failed phase shifters were employed for comparative analysis in this paper. The morphology and micro-composition after chemical unsealing were analyzed by using scanning electron microscope and electron probe energy disperse spectroscopy. The comparative results showed that the plastic surface of the capacitor near the output was obviously covered by the dendritic branches of metal atoms in the failed sample, causing the capacitor short-circuited. Combined with the production process, the failure reason was closely linked to the unqualified leakage problem near the two outputs. Further observation of the insulator in the output was conducted to reveal that the interface structure between glass matter and kovar alloy was non densification, and the crystalline of glass phase and gaps existing were also found. Therefore moisture as the medium entering from the weakness position into the cavity made metal migrated. On based of that, the corresponding improvements have been proposed to greatly suppress it.
  • Keywords
    capacitors; electromigration; failure analysis; insulators; phase shifters; scanning electron microscopy; capacitor plastic surface; chemical unsealing; electric loss problem; electron probe energy disperse spectroscopy; failed phase shifters; glass matter; glass phase crystalline; insulator; interface structure; kovar alloy; metal atom dendritic branches; phase shifter electromigration failure; production process; scanning electron microscope; unqualified leakage problem; Abstracts; Artificial intelligence; Lead; Probes; Substrates; Surface cracks; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474809
  • Filename
    6474809