DocumentCode
3506313
Title
Investigation on electromigration failure of phase shifter
Author
Zhenzhen Rao ; Shengxiang Bao ; Xiaowen Zhang ; Zuwen Wang ; Weiming Lai
Author_Institution
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2012
fDate
13-16 Aug. 2012
Firstpage
1141
Lastpage
1144
Abstract
Aiming at the problem of electric loss rises, the qualified and the failed phase shifters were employed for comparative analysis in this paper. The morphology and micro-composition after chemical unsealing were analyzed by using scanning electron microscope and electron probe energy disperse spectroscopy. The comparative results showed that the plastic surface of the capacitor near the output was obviously covered by the dendritic branches of metal atoms in the failed sample, causing the capacitor short-circuited. Combined with the production process, the failure reason was closely linked to the unqualified leakage problem near the two outputs. Further observation of the insulator in the output was conducted to reveal that the interface structure between glass matter and kovar alloy was non densification, and the crystalline of glass phase and gaps existing were also found. Therefore moisture as the medium entering from the weakness position into the cavity made metal migrated. On based of that, the corresponding improvements have been proposed to greatly suppress it.
Keywords
capacitors; electromigration; failure analysis; insulators; phase shifters; scanning electron microscopy; capacitor plastic surface; chemical unsealing; electric loss problem; electron probe energy disperse spectroscopy; failed phase shifters; glass matter; glass phase crystalline; insulator; interface structure; kovar alloy; metal atom dendritic branches; phase shifter electromigration failure; production process; scanning electron microscope; unqualified leakage problem; Abstracts; Artificial intelligence; Lead; Probes; Substrates; Surface cracks; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4673-1682-8
Electronic_ISBN
978-1-4673-1680-4
Type
conf
DOI
10.1109/ICEPT-HDP.2012.6474809
Filename
6474809
Link To Document