• DocumentCode
    3506442
  • Title

    Assembly technology by Multi-pin, HDF of PCB electrical connectors in Aerospace electronic products

  • Author

    Binbin Zhang ; Wei Zhang ; Meng Yang ; Yarong Chen

  • Author_Institution
    Beijing Spacecrafts, Beijing, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    1159
  • Lastpage
    1163
  • Abstract
    With the development of the spacecraft toward the direction of miniaturization, integration and function of complex, the packaging density of spacecraft electronic products gradually increased, PCB electrical connectors are widely used as an alternative to traditional soft wire, which is a way to realize spacecraft electronic products leadless. PCB electrical connectors play a significant role in the reliability of electrical connection and mechanical connection between PCB. FOR Aerospace electronic products, the reliability of PCB electrical connectors determines the life of the entire spacecraft. On the basis of the systematic analysis on the typical failure modes of Multi-pin, HDF of PCB electrical connectors, according to two common failure modes, mechanical failure because of PCB warping and solder joint failure because of incomplete penetration, this paper using finite element simulation analysis formulizes temperature field and stress - strain field during the assembly process of PCB electrical connectors were simulated, and the key process parameters are determined, such as soldering temperature, soldering time, soldering sequence and so on, and the simulation results are verified by experiments. The optimum process parameters can be used to ensure the reliability of Multi-pin, HDF of PCB electrical connectors in Aerospace electronic products.
  • Keywords
    electronics packaging; failure analysis; finite element analysis; reliability; space vehicle electronics; HDF; PCB electrical connectors; PCB warping; aerospace electronic products; assembly technology; electrical connection reliability; finite element simulation analysis; mechanical connection reliability; multipin failure modes; solder joint failure; soldering sequence; soldering temperature; soldering time; spacecraft development; spacecraft electronic product packaging density; stress-strain field; temperature field; Connectors; Heating; Joints; Soldering; Thermal conductivity; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474813
  • Filename
    6474813