• DocumentCode
    3506503
  • Title

    A study on the improvement of environment resistance in epoxy composite materials due to variation of network structure for developing out door insulator

  • Author

    Son, In-Hwan ; Kim, Tag-Yong ; Lee, Deok-Jin ; Kim, Kyung-Hwan ; Kim, Myung-Ho ; Kim, Jae-Hwan

  • Author_Institution
    Kwangwoon Univ., Seoul, South Korea
  • Volume
    2
  • fYear
    1997
  • fDate
    25 -30 May 1997
  • Firstpage
    871
  • Abstract
    Epoxy resin specimens introducing the IPN method, were manufactured and then measured and compared with single network specimens as for environment resistance and tracking resistance. As a whole, ten kinds of specimens were manufactured by filler content. SEM and XRD were utilized in order to understand their structures and components. Also, Weather-O-Meter experiment and tracking resistance tests were executed to measure outdoor environment resistance. As a result of SEM and XRD tests, the variation of network structure was confirmed, and the environment resistance and tracking resistance appeared to improved
  • Keywords
    X-ray diffraction; composite insulators; composite materials; electric breakdown; environmental testing; epoxy insulation; epoxy insulators; filled polymers; insulation testing; radiation effects; scanning electron microscopy; AC dielectric breakdown test; IPN method; SEM; UV degradation; UV radiation resistance test; Weather-O-Meter experiment; XRD; environment resistance; epoxy composite materials; epoxy resin specimens; filler content; outdoor insulator; polymer network structure variation; tracking resistance test; Composite materials; Dielectric breakdown; Dielectrics and electrical insulation; Electrical resistance measurement; Epoxy resins; Insulation life; Manufacturing; Scanning electron microscopy; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    0-7803-2651-2
  • Type

    conf

  • DOI
    10.1109/ICPADM.1997.616575
  • Filename
    616575