Investigation for the response of PCB assembly with five POP packages during dropping

Author

Yu Peng ; Fan Zerui ; Yao Xiaohu

Author_Institution

Sch. of Civil Eng. & Transp., South China Univ. of Technol., Guangzhou, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

1180

Lastpage

1184

Abstract

The dropping for Portable electronic produce may cause solder joint failure of packages by our miss handling, which leads to malfunction of product. Therefore, the investigation of response of PCB assembly during dropping is very important to the development or improvement of the product. According to JEDEC standard, in this paper, the response of PCB assembly with five POP packages will be studied in detail by experimental and Finite Element Methods (FEM). The dynamic strain response at some key points of PCB will be tested in drop test, and verified the simulation model. The simulation of PCB assembly is performed by the large commercial finite element software ABAQUS and the stress responses of solder joints during dropping are obtained in the simulation.

Keywords

electronic engineering computing; electronics packaging; finite element analysis; printed circuit manufacture; solders; FEM; JEDEC standard; PCB assembly; POP package; dropping method; dynamic strain response; finite element software ABAQUS; portable electronic; solder joint; stress response; Abstracts; Educational institutions; Integrated circuits; Joints; Lead; Reliability; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474818

Filename

6474818