Title :
Investigation for the response of PCB assembly with five POP packages during dropping
Author :
Yu Peng ; Fan Zerui ; Yao Xiaohu
Author_Institution :
Sch. of Civil Eng. & Transp., South China Univ. of Technol., Guangzhou, China
Abstract :
The dropping for Portable electronic produce may cause solder joint failure of packages by our miss handling, which leads to malfunction of product. Therefore, the investigation of response of PCB assembly during dropping is very important to the development or improvement of the product. According to JEDEC standard, in this paper, the response of PCB assembly with five POP packages will be studied in detail by experimental and Finite Element Methods (FEM). The dynamic strain response at some key points of PCB will be tested in drop test, and verified the simulation model. The simulation of PCB assembly is performed by the large commercial finite element software ABAQUS and the stress responses of solder joints during dropping are obtained in the simulation.
Keywords :
electronic engineering computing; electronics packaging; finite element analysis; printed circuit manufacture; solders; FEM; JEDEC standard; PCB assembly; POP package; dropping method; dynamic strain response; finite element software ABAQUS; portable electronic; solder joint; stress response; Abstracts; Educational institutions; Integrated circuits; Joints; Lead; Reliability; Stress;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474818
