Title :
Isothermal low cycle fatigue behavior of nano-silver sintered single lap shear joint
Author :
Xin Li ; Xu Chen ; Guo-Quan Lu
Author_Institution :
Sch. of Mater. Sci. & Eng., Tianjin Univ., Tianjin, China
Abstract :
To have a full description of the fatigue behavior of nano-silver sintered lap shear joint, isothermal low cycle mechanical fatigue test was conducted in a systematic manner over a wide range of temperatures (25 to 325°C) with the shear strain amplitude set at different values. The low cycle fatigue behavior of the sintered lap shear joint was found to be strongly dependent on test temperature. To investigate the temperature affection on fatigue life, a new life prediction model based on Basquin model was developed by transforming the fatigue strength exponent bth and fatigue strength coefficient, εfth as a function of temperature rather than numerical constants.
Keywords :
fatigue testing; life testing; nanoelectronics; semiconductor device packaging; semiconductor device testing; shear strength; silver; sintering; Basquin model; component packaging; fatigue life; fatigue strength coefficient; fatigue strength exponent; isothermal low cycle fatigue behavior; isothermal low cycle mechanical fatigue test; life prediction model; nano-silver sintered single lap shear joint; shear strain amplitude set; temperature 25 C to 325 C; temperature affection; test temperature; Abstracts; Fatigue; Reliability; Silver; Strain; Stress; Temperature distribution;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474824