Title :
An assessment method of electronic packaging reliability based on rough set theory
Author :
Ronghong Cui ; Yuting He ; Wenjun Shu ; Hua Ding ; Hou Bo
Author_Institution :
Aeronaut. & Astronaut. Coll., Air Force Eng. Univ., Xi´an, China
Abstract :
With the continuous improvements of IC integration,the electronic packaging reliability became more and more important. As a result, how to evaluate the reliability of the electronic packaging precisely has become a problem to be solved. In this paper, an index system from the packaging material, packaging process and packaging test is put forward. Then, considering many uncertainties induced by the absence and decentralization of electronic packaging information, a rough set theory based model is established to assess the electronic packaging reliability. It is shown from the case study that the model can make the assessment more objective and feasible because it can take more accounts of the uncertainties in the electronic packaging reliability analysis.
Keywords :
continuous improvement; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; rough set theory; IC integration; assessment method; continuous improvements; electronic packaging information; electronic packaging reliability analysis; index system; packaging material; packaging process; packaging test; rough set theory; Abstracts; Reliability;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474828