Analysis of POP solder ball thermal cycling fatigue life based on stress strain

Aiming to the solder ball reliability of package on package under the thermal cycling load, the three dimensional finite element model was established using ABAQUS. Temperature cycle load of pop thermal stress strain was analyzed and the fatigue life of solder joints was predicted. Results showed that the maximum stress solder ball was concentrated at package corner and the stress distribution presented dumbbell-shaped in the individual solder ball. The maximum cumulative equivalent creep strain was located in inner solder ball and at the edge of silicon chip.